Tag Archive: Qualcomm



Hours ahead of Apple’s major iPhone event, in which the company is widely expected to launch the iPhone 8, iPhone 8 Plus, and the iPhone X, its partner Qualcomm has stirred controversy by saying that Android smartphone makers are always first to bring new cutting technology feature to their products.

Qualcomm has shared more than 20 examples to make the case for how Android smartphone makers have been the first ones to introduce new features. Some of those examples include – fingerprint under display (Qualcomm Reference Design Handset), bezel-less design (first introduced in Xiaomi Mi Mix from last year), OLED Display (LG Flex 2) and Facial Recognition (Samsung Galaxy S8). Interestingly these all features are expected to be selling points of Apple’s supposedly upcoming iPhone models that the company would unveil later today. Other notable mentions are Gigabit LTE (Samsung Galaxy S8) and Bluetooth v5.0 (everything running the Snapdragon 835 SoC).

The telecom giant’s brutal blog post comes months after both of them have sued each other in global patent licensing dispute. Earlier this year, Apple sued the chipmaker for roughly $1 billion claiming that Qualcomm has been “charging royalties for technologies they have nothing to do with.” At the time, Qualcomm dismissed Apple’s accusation. But months later, it filed a lawsuit against Apple, asking the US trade regulators to ban iPhone imports, as they allegedly infringe on six patents. The patents, owned by Qualcomm, provide technology to improve battery life, Qualcomm said.

Meanwhile, on the blog post published on Monday, Francisco Cheng, director of technical marketing said it has “enabled some notable world firsts on Android, and some remain Android exclusives to this day. […] Inventions from Qualcomm lay the foundation for so many technologies and experiences we value in our smartphones today — on Android and other platforms.”

Apple would certainly not appreciate Qualcomm’s constant commentary on how rival products are better, especially on the day when it plans to launch its own flagship iPhone models.

 

 

Source : (gadgets.ndtv.com)

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Chip manufacturer Qualcomm has asked a US court to force Apple to pay up royalties for phone patents owned by Qualcomm.

Apple has stopped paying royalties to contract manufacturers for phone patents owned by Qualcomm over an “unresolved issue” – a move that will hit the US-chip maker’s financial results.

In a court filing, Qualcomm asked for a preliminary injunction against four of Apple’s suppliers – Foxconn, Pegatron, Wistron, and Compal – all of which it began suing for breach of contract earlier this month, The Verge reported on Thursday.

According to Qualcomm, Apple had instructed these companies in April not to pay royalties for devices they made using Qualcomm technology.

“Apple could litigate against Qualcomm indefinitely; it has virtually unlimited resources (more than $256 billion in cash reserves) and already has filed multiple cases against Qualcomm not just in this court, but around the world. And when those cases end, Apple can file more cases,” Qualcomm wrote in the court filing.

Qualcomm also alleged that Apple was trying to force a settlement by throwing its weight around.
“It goes on to say that Apple ‘has chosen commercial ransom over judicial process’ and that it’s trying to get an unfair deal on Qualcomm’s technology ‘through coercion enabled by its enormous market power,'” the report added.

Because of the missing payments, Qualcomm would suffer a loss of $500 million (roughly Rs. 3,222 crores) in revenue this quarter alone.

Earlier in April, the US chip manufacturer lambasted Apple for breaching deals between the two companies and urged that the lawsuit filed in January against it by the iPhone maker should be rejected.

Qualcomm also accused Apple of harming its business and sought unspecified damages.

Apple sued Qualcomm in January for nearly one billion dollars over royalties, with the Cupertino-based tech giant alleging the wireless chipmaker did not give fair licensing terms for its processor technology.

But Qualcomm refuted the allegations, saying that Apple had intentionally mischaracterised the agreements and negotiations, as well as the enormity and value of the technology they had invented, contributed and shared with all mobile device makers “through our licensing programme”.

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Source : (gadgets.ndtv.com)


Earlier this week, security researchers reported that Qualcomm-based Android devices were exposed to attack by the ‘QuadRooter’ vulnerability, affecting nearly 900 million devices.

Now, Sony has said that the QuadRooter security fix for its smartphones will come through regular software maintenance and has advised users to upgrade their devices regularly. To recall, if the QuadRooter vulnerabilities are exploited, attackers can gain the full control of the affected phone or tablet.

Sony Mobile has been quoted by Xperia Blog as saying:

“Sony Mobile takes the security and privacy of customer data very seriously. We are aware of the ‘QuadRooter’ vulnerability and are working to make the security patches available within normal and regular software maintenance, both directly to open-market devices and via our carrier partners, so timings can vary by region and/or operator. Consumers are recommended to continuously upgrade their phone software in order to optimize performance of their Xperia smartphone. Users can take steps to protect themselves by only downloading trusted applications from reputable application stores.”

Qualcomm claims that patches for the issue were released to “customers, partners, and the open source community between April and the end of July.”

lthough fixes for three of the four vulnerabilities have already made it to recent Android monthly security updates rolled out by Google, the remaining one will be included in the September update.

Google, in response to ‘QuadRooter’, announced that its ‘Verify Apps’ feature in Google Play Services effectively blocks all apps that possess QuadRooter vulnerabilities from installing. The ‘Verify Apps’ feature is currently available to all the Android devices running on v4.2 Jelly Bean and above. According to the latest figures released by the search giant, this comprises of around 90.6 percent of all the devices that visit Google Play.

 
Source : (gadgets.ndtv.com)


Qualcomm has confirmed that it is optimising Snapdragon chipsets for supporting Google’s Tango (formerly Project Tango) machine vision framework for augmented and virtual reality. The chipset maker revealed that it has been working closely with Google for over a year with the Project Tango team ensure it runs on Snapdragon processors.

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Qualcomm has confirmed that the high-end Snapdragon 820 as well as the Snapdragon 652 chipsets already support Project Tango. The company also announced that the future Snapdragon 800 and 600 series SoCs will support Google’s Tango.

Talking to Ars Technica, Seshu Madhavapeddy, VP, Product Management for Qualcomm, said, “We are committed to Tango and we believe in this technology. We see broad adoption of this technology as forthcoming and we would like to support that.”

Google’s first prototype for the Tango augmented reality included the Movidius computer vision chip; though the consumer version announced recently with Lenovo – the Phab 2 Pro – had no extra chipset, points out Ars Technica.

The chipmaker explained that this was possible with the “Snapdragon Heterogeneous Processing Architecture,” which means the DSP, sensor hub, and Image Signal Processor (ISP) perform the compute duties in a Tango phone.

Qualcomm claims with its new technology, Tango phones will be able to handle “algorithms and sensors with a less than 10 percent CPU overhead compared to a normal app.”

To recall, Lenovo earlier this month at its Tech World 2016 event in San Francisco unveiled the first consumer facing Project Tango smartphone called the Lenovo Phab 2 Pro. The smartphone is expected to start shipping in August and has been priced at $499 (roughly Rs. 33,500).

 

Source : (gadgets.ndtv.com)


Qualcomm Technologies on Thursday introduced three new mobile chipsets, namely the Snapdragon 625, Snapdragon 435, and the Snapdragon 425. All three will become available in smartphones from the second half of 2016. As per the company, “the advancements and innovations inside these mobile processors are designed to support better experiences, higher performance, and longer battery life.” It also unveiled a new SoC for smartwatches, the Snapdragon Wear 2100 (due in the first devices in the second half of 2016), and the Snapdragon X16 gigabit LTE modem (also due in the second half of 2016).

All three mobile SoCs include support for LTE with carrier aggregation, Wi-Fi 802.11ac with MU-MIMO, dual camera ISPs, Qualcomm Hexagon DSP (digital signal processor) for audio and a sensor hub, and Qualcomm Quick Charge 3.0.

The Snapdragon 625 is also the company’s first to use 14nm FinFET technology. The SoC features eight ARM Cortex-A53 cores at 2GHz; Qualcomm Adreno 506 GPU, and OpenGL ES 3.1+. It supports eMMC 5.1 storage with SD 3.0 (SDCC); LPDDR3 933MHz memory; up to 24-megapixel camera with Dual Image Sensor Processor (ISP); up to 4K resolution video capture and playback with H.264 (AVC) and H.265 (HEVC) support, and up to 1900×1200 display at 60fps or 1080p.

The chipset also supports X9 LTE connectivity with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/EDGE. It can handle LTE Cat. 7 speeds of up to 300 Mbps download speeds and up to 150 Mbps upload speeds, up to 2×20 MHz carrier aggregation. On the connectivity front, the SoC supports USB 3.0, NFC, and Bluetooth 4.1.

The Qualcomm Snapdragon 425 features four ARM Cortex-A53 cores at up to 1.4GHz; Qualcomm Adreno 308 GPU, and OpenGL ES 3.0. It supports eMMC 5.1 storage; LPDDR3 667MHz memory; up to 16-megapixel camera with Dual Image Sensor Processor (ISP); up to 1080p video capture and playback with H.264 (AVC) and H.265 (HEVC), and up to 1280×800 display at 60fps or 720p.

The chipset comes with support for the X6 LTE connectivity with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/EDGE. It can handle LTE Cat. 4 speeds of up to 150 Mbps download speeds and up to 75 Mbps upload speeds, and up to 2×20 MHz carrier aggregation. On the connectivity front, the SoC supports USB 2.0, NFC, and Bluetooth 4.1.

Lastly, the Qualcomm Snapdragon 435 sports eight ARM Cortex-A53 cores at up to 1.4GHz; Qualcomm Adreno 505 GPU, and OpenGL ES 3.1+. It supports eMMC 5.1 storage with SD 3.0 (UHS-I); LPDDR3 800MHz memory; up to 21-megapixel camera with Dual Image Sensor Processor (ISP); up to 1080p video capture and playback with H.264 (AVC) and H.265 (HEVC), and up to 1080p display at 60fps along with 1080p output.

The chipset supports X8 LTE connectivity with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/EDGE. It can handle LTE Cat. 7 speeds of up to 300 Mbps download speed and up to 100 Mbps upload speed, and up to 2×20 MHz carrier aggregation. On the connectivity front, the SoC supports USB 2.0, NFC, and Bluetooth 4.1.

Coming to the Snapdragon Wear 2100 SoC, the company says it is 30 percent smaller than the Snapdragon 400 used in most smartwatches nowadays, while also consuming 25 percent less power than it. The SoC’s connectivity has also been boosted, and comes with improved modems for Bluetooth, LTE, and Wi-Fi.

Qualcomm’s calling the Snapdragon X16 LTE the world’s first commercially announced modem to support gigabit class LTE speeds – up to 1Gbps. It makes it 100 percent faster than its previous Snapdragon X10 LTE modem, that delivered speeds up to 450Mbps. It uses carrier-aggregation just like the Snapdragon X10, using three 20MHz carriers but capturing up to 10 streams of LTE data this time around with four antennas. Combined with new signal processing, it is able to boost the throughput of each stream to 100Mbps. The company said the X12 was the first to use this signal processing, with up to 6 streams of data at up to 600Mbps.

Source : (gadgets.ndtv.com)


The Department of Industrial Policy & Promotion (DIPP) and Qualcomm through its venture investment arm, Qualcomm Ventures, announced Thursday, the “QPrize Make in India” contest for startups, which will award $350,000 (roughly Rs. 2.3 crores) in equity investment as prize money to the winning startup.

The goal of the contest is to catalyse India’s startup community to drive the entire value chain from innovation to creating a local product design and manufacturing ecosystem manufacturing in India, DIPP said.

Startups can submit their entries to the contest on the Make in India website, the last date for submitting entries is February 12, 2016. DIPP will announce the shortlist on February 15, 2016.

Shortlisted companies will be invited for the final pitch presentation during the grand finale on February 18, 2016, which will be held at the Make in India Centre, MMRDA Grounds, Bandra – Kurla Complex.

“We are delighted to announce the QPrize Make in India contest that will be a driving force for Indian entrepreneurs aligning with our Prime Minister Modi’s vision for Startup India and Make in India,” said Amitabh Kant, Secretary, Department of Industrial Policy & Promotion (DIPP), Ministry of Commerce and Industry, Government of India in a press statement. “Besides the Rs. 2-Crore prize money through equity investment, they will bring in immense experience and support to nurture the startups through their Qualcomm Ventures arm and Design in India initiatives targeted towards making India a hub for design and manufacturing,” he added.

Prime Minister Narendra Modi will inaugurate the Make in India Week, which will be held from February 13 to 18. The government expects participation of over 1,000 companies and delegates from over 60 countries. The theme of the event will be innovation, design, and sustainability.

Source : (gadgets.ndtv.com)


Qualcomm at its recent CES keynote address confirmed the Chinese brand LeTV’s Le Max Pro will be the first handset to sport the Snapdragon 820 processor.

The smartphone however was not officially revealed at the event and was announced to be on sale in the first half of 2016. Now, a Chinese mobile site has claimed purported pricing of the Le Max Pro. According to Mobile-Dad, the Le Max Pro will be priced at CNY 3,500 (roughly Rs. 35,500).

We got a chance to play with the Le Max Pro at CES 2016, and some of the specifications we gleaned include a 6.33-inch display with a QHD (1440×2560 pixels) resolution, and 4GB of RAM. It is backed by a 3400mAh battery. It will be available 32GB, 64GB, and 128GB storage variants. The handset sports a 21-megapixel rear camera and comes with optical image stabilisation (OIS). The dual-SIM Le Max Pro supports 4G LTE connectivity option and comes with USB Type-C port. The smartphone is running Android 6.0 Marshmallow with a customised UI from LeTV on top. The Snapdragon 820 SoC was found to be clocked at 2.2GHz, which means LeTV has not under-clocked the processor from the reference clock speed.

Qualcomm during the CES keynote had also revealed that the Le Max Pro will support Qualcomm Quick Charge 2.0 technology that can charge the phone from 0 to 60 percent charge in 30 minutes.
The Chinese company hasn’t officially launched the Le Max Pro and we will have to wait for the unveiling. Unfortunately, the smartphone is still not listed on the company’s official store, the lemall.com. Apart from the Snapdragon 820, the Le Max Pro will also pack features such as Qualcomm’s Snapdragon Sense ID ultrasonic fingerprint technology that’s claimed to be more secure than capacitive sensors.

At CES, China-based LeTV also unveiled Super 4 Max65 Blade claiming it to be the “world’s thinnest TV 65-inch TV.”

Source : (gadgets.ndtv.com)


We’ve been hearing about Google’s Project Tango for over a year now, and according to a report, it is finally coming to fruition, with a major PC manufacturer looking to use the technology.

Google and Lenovo have shared a teaser (via Android Headlines) for a Thursday announcement, with the words, “Mobile devices should see and navigate the world, the way we do. Join Lenovo & Google’s Project Tango for a special announcement…” According to a report by ComputerWorld, a product line using Project Tango is likely to be announced at CES 2016 by Lenovo, including a consumer-facing product.

To recall, Lenovo in late 2014 acquired Motorola Mobility from Google, though the Internet giant retained the mobile firm’s Advanced Technology and Projects (ATAP) group.

Not much is known about the Project Tango devices Lenovo reportedly intends to launch at CES 2016, but applications of machine vision in mobile devices can be expected.

Project Tango is an imaging technology that uses a combination of various sensors to “see” the environment around you and generate spatial awareness for your phone. Developed by a team led by former Kinect lead Johnny Lee, Tango was created by Google’s Advanced Technology And Projects group, and uses a number of different sensors on your phone or tablet to create a sophisticated picture of the world around it.

An infrared emitter and infrared camera act as a range-finder to measure the distance between your phone and various objects, allowing them to be mapped in three dimensions. A wide angle camera adds details about the location, and other phone sensors including accelerometers, gyroscopes, and barometers combine to help Tango calculate not just what is around your phone or tablet, but also the angle at which you are looking at an object, how far away it is, and what it looks like.

This level of detail is an incredible technical feat, and Tango could have many applications for users. And developers won’t have to work on it from the ground up, as Google has APIs to allow them to use data from Tango.

There are multiple APIs that developers can use, which could see Tango getting integrated into a wide variety of apps, just as other sensors on your phone get used in different ways. For one thing, you could now have apps that can easily measure the dimensions of an object – once you know an object’s distance from the camera, basic geometry can be used to figure out the rest.

Capturing 3D images using the depth sensor is another possibility – right now there are plenty of apps that allow you to take two images side by side with a slightly shifted perspective, but of course, that only provides the illusion of depth. Tango could make it possible to scan your entire room and have your furniture stand out in the virtual environment, leaving you free to roam around it.

Imagine combining that with a cheap headset like Google Cardboard to showcase homes to prospective buyers. Real estate companies in India are already doing this with 2D photos, and investing in expensive 3D photography solutions that can cost close to a lakh. Project Tango can bring the technology into the cellphone in your pocket, if it catches on.

The growing interest in Virtual Reality and Augmented reality shows just how Project Tango could mature. We already have apps such as “smart” books for children that come alive when viewed through a screen. This could become far more powerful with Project Tango, as you would be able to explore this virtual world and view it from different angles, using the other sensors on your phone as a guide.

Project Tango partners include Nvidia, Qualcomm, and Intel. Only MediaTek is missing from this list, and if the first few Tango devices can deliver on their promise, then that won’t be the case for long either. It’s very likely that in the next year or so, the technology behind Tango is going to become as common as having a gyroscope on your phone.

Source : (gadgets.ndtv.com)


Qualcomm Inc has decided not to split into separate chipmaking and technology licensing businesses, concluding a six-month strategic review instigated by hedge fund Jana Partners.

San Diego-based Qualcomm, the biggest maker of chips used in mobile phones, said on Tuesday its current structure offered unique strategic benefits that cannot be replicated.

Qualcomm, whose earnings have slumped by more than 40 percent in each of the last three quarters, said it had “a focused plan” in place that it believed would drive growth. Chief Executive Steve Mollenkopf did not elaborate.

The company has also said all along that its existing structure allowed it to leverage relationships with Chinese customers, which are expanding quickly into other countries.

Jana, which owned about 28.6 million Qualcomm shares as of September 30, is comfortable with Qualcomm’s decision and supportive of the board’s efforts, people familiar with the matter said.

Qualcomm said business in the current quarter was stronger than expected as 3G and 4G device shipments were helping its licensing business and cost cuts were taking hold.

The chipmaker said it now expected earnings per share for the quarter to be at or modestly above the high end of its forecast range. The company had forecast earnings of 80-90 cents per share for the quarter.

The technology licensing business has driven Qualcomm’s profits for years, thanks to the royalties it collects on the chip-technology developed by its chipmaking unit.

“I think it’s better that they didn’t split. I’m happy about that,” Tigress Financial Partners analyst Ivan Feinseth said.

Qualcomm can continue to outsource hardware manufacturing without having to go through a split, he said.

Acquisitions considered

Some analysts expressed surprise that Qualcomm did not come up with any value-boosting plans.

“We have a hard time believing that keeping the status quo will help the stock rebound,” BMO Capital Markets analyst Tim Long wrote in a note.

Qualcomm’s shares, which have fallen almost 40 percent this year, were up 3.3 percent at $47.39 in late morning trading.

The special committee that carried out the review included two members nominated by Jana, which unleashed a public campaign to reform Qualcomm in April.

Mollenkopf, on an analysts’ call, said acquisitions were considered as part of the review.

Chipmakers have raced to merge this year as they seek to meet demand for cheaper chips and to diversify their offerings to adapt to new trends such as the “Internet of Things.”

Feinseth said Qualcomm should also join the fray, buying, for example, Apple supplier Skyworks Solutions Inc.

Qualcomm, which has been facing a host of problems in China including delays in closing new licensing agreements, said on Tuesday it was making progress on closing the deals.

Source : (gadgets.ndtv.com)


Intel Corp., the world’s biggest chipmaker, said it appointed Murthy Renduchintala as a company president and gave him control of two of its biggest business divisions.

Renduchintala, who left Qualcomm Inc. after losing out in a leadership shakeup, will oversee a new unit including Intel’s personal-computer chip and Internet of Things divisions its biggest source of revenue and one of its fastest-growing businesses, respectively, the company said in a statement.

“The caliber of leadership and experience Murthy brings to our executive team represents a significant move toward delivering the benefits of our strategy even faster than before,” Intel Chief Executive Officer Brian Krzanich said in the statement.

While Intel and Qualcomm are leading producers of microprocessors, they have so far failed to encroach on each other’s turf. Intel has more than 80 percent of the market for chips that power PCs and all of the server market, but has racked up losses in a futile attempt to dent Qualcomm’s hold on the mobile phone processor business. For its part, Qualcomm has only just announced its first test chip for servers and hasn’t been able to find buyers for its designs for PCs.

Renduchintala was at Qualcomm for more than a decade and rose to be the co-head of its chip business. The company recently appointed Cristiano Amon to run that division.

“Murthy was offered another role within Qualcomm, but he chose to leave the company instead,” the San Diego-based chipmaker said in an email.

While Intel has led the chip market in processing performance and manufacturing, Qualcomm’s chip designers have delivered better systems on chips, semiconductors that combine the functions of several different devices into once piece of silicon. That type of chip, including communications, is increasingly taking over in mobile devices.

Source : (gadgets.ndtv.com)