More rumours for the upcoming Apple flagship smartphone, the iPhone 7, continue to pour in. This time a report suggests that handset in question will ditch the rear camera bump seen in the iPhone 6 and iPhone 6s Plus with the help of a thinner camera module. The antenna bands at the back will reportedly also be removed to give a cleaner look.

A report from Mac Rumors cites a reliable source who says that the handset will still sport antenna bands, which would now stick to the sides, top and bottom edges. The overall design would stay the same as its predecessors. Apple is far from confirming the aforementioned design changes so the information should be taken with a pinch of salt. Nothing specific has been mentioned about the anticipated iPhone 7 Plus in the report.

Both the rumoured iPhone 7 and the iPhone 7 Plus are said to be unveiled in September this year. While the iPhone 7 is expected to feature a traditional primary camera, its ‘Plus’ sibling is tipped to sport a dual-lens camera design.

Another rumour revolving around the iPhone 7 and the iPhone 7 Plus is the demise of the 3.5mm headphone jack. The company is said to be working with Beats Electronics to develop “truly wireless” earphones – which is to say, the wireless earphones will feature no wires between the left and the right earbuds.

Previous reports add that the company might also be making its iPhone 7 models “completely waterproof” with the help of nanocoating. However, it is more likely to be water-resistant in reality. Wireless charging support is another functionality that could be debuting this year.

In addition, it has been mentioned that the rumoured iPhone 7 audio system will include new noise-cancellation technology from UK-based Wolfson Microelectronics, now a part of Cirrus Logic. A larger battery and 256GB inbuilt storage variant are also tipped.

Source : (gadgets.ndtv.com)

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